Tehnologija izrade čipova
| Vreme | 05. decembar 2025. 12:15 |
|---|---|
| Predavač | dr Goran Mišković |
| Organizator | Infineon Technologies Austria AG |
| Mesto | Sala 61 |
Apstrakt predavanja:
U sklopu ovog predavanja, celokupan savremeni postupak proizvodnje poluprovodničkih naprava će biti prikazan i objašnjen, kako na primeru diskretnih komponenti, tako i na primeru modula. Biće prikazane i objašnjene različite tehnologije koje se danas upotrebljavaju kako u frontend, tako i u bekend segmentu proizvodnje. Različite savremene tehnologije za litografiju, metalizaciju, jonsku implantaciju, separaciju, pakovanja čipova, itd. će biti prikazane i objašnjene. Predavanje će biti upotpunjeno uzorcima iz različitih segmenata prave proizvodnje koji će prisutnima biti dostupni za analizu i vizuelnu inspekciju
Biografija predavača:
Dr. Goran Mišković (Senior Project Manager) IEEE Senior member and nanopackaging TC member, certified IMPA C Project Manager.
He received his Ph.D. with honors in 2016 from the Vienna University of Technology (TU Wien), where he dealt with metal oxide-based gas sensors, with an accent on the detection of NOx gasses. From 2012 to 2016, he worked as a lecturer and project assistant on two FP7 projects as well as on several bilateral and industrial projects at TU Wien, where he dealt with sensors and actuators. After completion of his doctoral studies, he switched to the industry and joined TDK Electronics, where he worked in the corporate R&D - innovative topic group. His main activities and responsibilities were the evaluation and assessment of new technologies, concepts and ideas. From 2020 to 2023, he has worked at Silicon Austria Labs, Austria’s reputable R&D and competence center, as a member of the Sensor System research division. His main activities and responsibilities were project acquisition, planning & coordination, coordination of SAL science talks and member of PM office contribution toward improvement of operation excellence. Since June 2023 he has joined Infineon Technologies as a member of Technology Excellence group, Predevelopment Team. Dealing with predevelopment and roadmaking activities over the entire FE cluster for all Infineon’s technologies, bridging FE and BE domains.
My focus has been on spearheading predevelopment and innovation projects in wafer technology and packaging across global locations. Together with my project teams I work collaboratively to identify cost-efficient process and advanced technology solutions for diverse applications in automotive, consumer, and industrial sectors.
O kompaniji: